CPU
    Supports Intel® Socket P, Core™ 2 Duo Family Processors
    Supports 800 FSB CPU

内存
    2 x DIMM, Dual channel DDR2 533/667 MHz up to 4 GB

芯片组
    Chipset    Intel® GME965
    ICH8M I/O Controller Hub

BIOS
    Award System BIOS
    Plug & Play support
    4M bits flash ROM

网络
   Intel 82573L LAN Chip
    5 x PCI Express x 1 Lanes down to the carried board
    Supports PXE LAN boot ROM for Ethernet Boot up
    Supports Wake on LAN

显示
    Intel® GME965 integrated graphics solution w/ Intel® Extreme Graphics 2 technology
    Up to 64 MB of dynamic video memory allocation
    One PCI Express x 16 Lane down to the carried board
    Drive a standard progressive scan analog monitor with resolution up to 2048 x 1536 @ 60Hz
    Supports LFP (local flat panel) LVDS interface resolution up to 1366 x 768
    Single- or dual-pixel LVDS panel support up to UXGA panel resolution (1600 x 1200)
    Supports Single channel for 24 bit/Dual channel for 24 bit
    Supports UXDA 1600 x 1200 @ 75HZ (4:3)
    Supports WUXDA 1920 x 1200 (Wide Screen)
    Supports S-Video up to 1024 x 768 NTSC/PAL and 1080p HDTV

Audio    HD Audio Interface

COM Express Connectors    AB
3 x SATA / LVDS / 8 x USB 2.0 / 5 x PCIe x1 / GPIO / VGA / HDTV / HD Audio / RTC / BIOS Disable
    CD
IDE / PCI / SDVO / PCIex16

板载RTC
    On chip RTC with battery back up
    1 x external Li-ion Battery
    RTC Torrance less than 2sec (24 hours) under 25˚C environment

系统监控
    Derived from Super IO to support system monitor
    Monitoring of 4 voltages, 2 temperatures and 1 fan Speed
    4 voltage (For +3.3 V, +5 V, +12 V, Vcore)
    2 Temperatures (CPU and one external Temperature Sensor)

电源需求   Follow the COM Express Specification

尺寸    COM Express Extended Module Type 2,155 mm (L) x 110 mm (W) (6.1 x 4.3)

环境
    操作温度: 0°C to 60°C
    存储温度: -20°C to 85°C
    相对湿度: 5%~95%( 无凝露)

认证
    CE approval
    FCC Class A